Chipset & Memory Coolers reviews and tests
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Chipset & Memory Coolers – Test Results
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DLTECH Copper heatsink, heat sink 25 × 25 × 7 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 25 × 25 × 7 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 20 × 20 × 7 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 20 × 20 × 7 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 30 × 20 × 7 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 30 × 20 × 7 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 22 × 8 × 4 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 22 × 8 × 4 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 22 × 8 × 5 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 22 × 8 × 5 mm, 1pc in the package
DLTECH Copper heatsink, heatsink 13 × 12 × 5 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 13 × 12 × 5 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 10 × 10 × 7 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 10 × 10 × 7 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 15 × 15 × 7 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, dimensions (l × w × h) 15 × 15 × 7 mm, 1pc in the package
DLTECH Copper heatsink, heat sink 6 × 6 × 5 mm
Motherboard Cooler - passive heat dissipation from overheating chips, VRM chipset cooling for network and audio controllers without cooling, high thermal conductivity, limiting the drop in performance due to overheating, quiet operation without moving parts, Pre-applied thermally conductive self-adhesive tape, 1 piece in the package, dimensions 6 × 6 × 5 mm
No longer sold
Chipset & Memory Coolers - articles
ASUSASUS ROG RYUO IV SLC 360 ARGB – Bezkonkurenčná dizajnovka, ale... (RECENZIA)
Nielen v segmente chladičov sa už nejaký čas prejavuje trend uprednostňovania dizajnu, ktorý ženie ceny nahor. Chladič je však stále chladič a má predovšetkým poriadne chladiť. Jedným z posledných prejavov dnešnej doby je nový Ryuo IV SLC 360 ARGB od ASUS ROG so 6,67"...
S novými Intel Core Ultra Series 2 procesormi sa na trh nedostali len nové Z890 dosky, ale aj chladiče. ASUS ROG upravil svojho súčasného Ryujina III. generácie do tzv. Extreme verzie, ktorá skrýva hneď niekoľko vylepšení. V dnešnej recenzii sa pozrieme, k akým upgradom...
Premýšľate o chladení procesora vodou, ale nemôžete si v neprebernom množstve AiO chladičov vybrať ten pravý? V nedávnom porovnávacom teste 38 chladičov sa umiestnil na krásnom treťom mieste ASUS ROG RYUO III 360 ARGB, a tak sme si povedali, že si zaslúži vlastnú sólo...
water coolingNajlepšie vodné chladenie pre procesory (AiO 360 mm)
Vyberáte vodné chladenie na procesor vo veľkosti 360 mm a nemôžete si vybrať? V tomto článku sme porovnali 17 AiO a podrobili ich prísnym testom na 200 W a 300 W pri nízkych, stredných a maximálnych otáčkach. Zmerali sme teploty aj hlučnosť. Ktorý chladič vyšiel...
Iste vám niekedy napadlo zistiť, aký má váš počítač výkon a či pracuje správne. Prinášame podrobný návod, ako otestovať výkon PC. Ukážeme si, ako otestovať výkon procesora, grafického adaptéra či systémovej jednotky. Taktiež sa pozrieme na meranie prevádzkovej teploty...
Leto je čas odpočinku a nie vždy máte chuť, alebo to počasie neumožňuje, tráviť ho vonku. Najvyšší čas pustiť sa do upgradu vášho herného stroja. A teraz je ten pravý čas – aj preto, že pri nákupe vybraných výrobkov môžete ušetriť až 140 € – a ešte viac ušetríte, ak si...
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