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Zalman Thermal Compound ZM-STG1

Catalogue
Zalman Thermal Compound ZM-STG1
4.5 90 rating
Thermal Paste
Code:  CA099f Product Number:  ZM-STG1 Producer's Website:

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Zalman Thermal Compound ZM-STG1 Discontinued

Zalman Thermal Compound ZM-STG1

Brand thermal paste designed to improve heat conductivity between the heat source and the cooler. It is intended for common use for processors, graphics cards, chipsets, memory cards and more. It also improves the contact between both parts, helping to reduce the temperature and prolong the life of expensive integrated circuits. In addition, the paste is completely non-conductive, so there is no risk of short-circuiting due to accidental spraying of the components.

Properties:
Thermal conductivity: 1.2 W/m.K
Operating temperature: -50 to 170°C
Storage temperature: below 10°C
Quantity: 1.5g

Note: The grease must be applied in a very thin layer and only to the points of direct contact between the chip with the cooler.

Specifications can be changed without notice. Images are for illustrative purposes only.

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Accessories for Zalman Thermal Compound ZM-STG1 Chcete doručit zboží do Česka? Prohlédněte si Zalman Thermal Compound ZM-STG1. Für Versand nach Deutschland, besuchen Sie bitte Zalman Wärmeleitpaste ZM-STG1. Für Versand nach Österreich, besuchen Sie bitte Zalman Wärmeleitpaste ZM-STG1. Magyarországra történő kiszállításért tekintse meg ezt a termékoldalt: Zalman Thermal vegyület ZM-STG1.
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