DLTech Thermal Pad 90 × 50 × 1.5 mm 15W/mK
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DLTech Thermal Pad 90 × 50 × 1.5 mm 15W/mK
The DLTECH Thermal Pad is designed to transfer heat between a heatsink and electronic components, such as VRM modules or memory chips. It has a thermal conductivity of 15W/mK, which helps to maintain optimal operating temperatures for your components. The pad contains no metal particles, is electrically non-conductive, and does not cause short circuits, making it safe to use.
Key features of the DLTECH Thermal Pad
- Designed for heat transfer between a heatsink and components like VRMs and memory chips
- Thermal conductivity of 15W/mK
- Electrically non-conductive and non-corrosive
- Contains no metal particles and does not cause short circuits
- Non-toxic design
- Dimensions: 90×50×1.5mm (L×W×H)
Safe material properties
The pad is made from an electrically non-conductive material that does not cause short circuits. Its composition contains no metal particles, making it safe for use near sensitive electronic circuits. The material is also non-corrosive, so it won't damage the surface of components or the heatsink, even with long-term contact. Its non-toxic design ensures safe handling during installation.
Specifications
Thermal conductivity
Dimensions
Lukáš Drahozal, Vystrkov 118, [email protected], +420736762366
Specifications can be changed without notice. Images are for illustrative purposes only.
