DLTech Thermal Pad 90 × 50 × 2.25 mm 15 W/mK

The DLTECH thermal pad provides efficient heat transfer between electronic components and their heatsinks. Thanks to its thermal conductivity of 15W/mK, it fills the microscopic imperfections on the surfaces of the chip and heatsink, thereby improving cooling. This contributes to quieter computer operation and can extend the lifespan of components such as processors or graphics cards. The pad is electrically non-conductive, which increases safety during installation and use.

High performance and safety

The pad ensures a reliable connection between the heat-generating component and the heatsink. Its thermal conductivity of 15W/mK allows for rapid heat dissipation, helping to maintain an optimal operating temperature. The material contains no metal particles and is electrically non-conductive. This prevents the risk of a short circuit in case of contact with surrounding components on the board. You can also easily trim the pad to the exact size you need for your application.