DLTech Thermal Pad 90 × 50 × 2.75 mm 15 W/mK
DLTech Thermal Pad 90 × 50 × 2.75 mm 15 W/mK
The DLTECH thermal pad provides efficient heat transfer between electronic components and a heatsink. Thanks to its high thermal conductivity of 15W/mK, it significantly improves cooling efficiency, which can contribute to more stable performance and quieter computer operation. The pad contains no metal particles and is electrically non-conductive, making it safe to use even near sensitive components. It easily conforms to surfaces and fills gaps between components.
Key features of the DLTECH 90×50×2.75mm thermal pad
- Designed for efficient heat transfer between a component and its heatsink
- Thermal conductivity of 15W/mK
- Electrically non-conductive composition with no metal particles
- Material density of 3.38g/cm³
- Dimensions 90×50×2.75mm (L×W×H)
High efficiency and safe use
The DLTECH thermal pad improves heat transfer between a hot component and its heatsink. By maintaining lower operating temperatures, it contributes to more stable computer performance and can also lead to quieter fan operation, as they do not need to run at full speed. Its safe use is supported by an electrically non-conductive composition without metal particles, which eliminates the risk of short circuits even when in contact with sensitive electronic circuits.
Specifications
Specific Features
Thermal conductivity
Dimensions
Lukáš Drahozal, Vystrkov 118, [email protected], +420736762366
Specifications can be changed without notice. Images are for illustrative purposes only.
